Method of forming metal-containing film

ABSTRACT

Provided are a semiconductor device manufacturing method and a substrate processing apparatus that are capable of increasing a work function of a film to be formed, in comparison with a related art. The method comprises: (a) supplying a metal-containing gas simultaneously with one selected from the group consisting of an oxygen-containing gas, a halogen-containing gas and combinations thereof into a processing chamber accommodating the substrate; and (b) supplying a nitrogen-containing gas with one of the oxygen-containing gas, the halogen-containing gas and the combinations thereof into the processing chamber.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This U.S. non-provisional patent application is a continuation of U.S.patent application Ser. No. 13/398,523 filed on Feb. 16, 2012 in USPTO,and claims priority under 35 U.S.C. §119 of Japanese Patent ApplicationNo. 2011-033243 filed on Feb. 18, 2011 and Japanese Patent ApplicationNo. 2012-017827 filed on Jan. 31, 2012, in the Japanese Patent Office,the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device manufacturingmethod and a substrate processing apparatus.

2. Description of the Related Art

A process of forming a thin film on a substrate is one process in asemiconductor device manufacturing method, and processing of forming athin film on a substrate is one example of processing by a substrateprocessing apparatus. One technique of forming a thin film on asubstrate is a chemical vapor deposition (CVD) method. The CVD method isa method of forming a film, which is formed of an element included in asource molecule, on a substrate using a reaction of two or more kinds ofsource materials in a gas phase or on a substrate surface. In addition,as another technique of forming a thin film on a substrate, there is atechnique in which two or more kinds of source materials used infilm-forming are alternately supplied onto a substrate one by one andthe film forming is controlled in the order of atomic layer using asurface reaction under certain film-forming conditions (a temperature,time, and so on).

As a metal film formed on a substrate, for example, a titanium nitride(TiN) film disclosed in Patent Document 1 may be exemplified. The TiNfilm may be formed by, for example, reacting titanium tetrachloride(TiCl₄) with ammonia (NH₃).

RELATED ART DOCUMENT Patent Document

1. International Publication No. 2007/020874

SUMMARY OF THE INVENTION

However, according to a used material, a value of a work function of afilm to be formed may be lower than a desired value.

It is an aspect of the present invention to provide a semiconductordevice manufacturing method and a substrate processing apparatus capableof increasing a value of a work function of a film to be formed, incomparison with the related art.

In order to solve the problems, there is provided a semiconductor devicemanufacturing method of forming a metal-containing film on a substrate,the method comprising: (a) supplying a metal-containing gassimultaneously with one selected from the group consisting of anoxygen-containing gas, a halogen-containing gas and combinations thereofinto a processing chamber accommodating the substrate; and (b) supplyinga nitrogen-containing gas with one of the oxygen-containing gas, thehalogen-containing gas and the combinations thereof into the processingchamber.

The semiconductor device manufacturing method may further includeremoving the metal-containing gas remaining in the processing chamberafter performing the step (a); removing the nitrogen-containing gasremaining in the processing chamber after performing the step (b); andremoving the one of the oxygen-containing gas, the halogen-containinggas and the combination thereof remaining in the processing chamberafter performing the step (c).

In addition, there is provided a semiconductor device manufacturingmethod of forming a metal-containing film on a substrate, the methodcomprising: (a) simultaneously supplying a metal-containing gas and anitrogen-containing gas into a processing chamber accommodating thesubstrate; and (b) supplying one selected from the group consisting ofan oxygen-containing gas, a halogen-containing gas and combinationsthereof into the processing chamber, wherein a time duration ofsupplying the metal-containing gas is shorter than that of thenitrogen-containing gas in the step (a), and the steps (a) and (b) arealternately performed as a temporally separated pulse.

Further, the present invention provides a semiconductor devicemanufacturing method of forming a metal-containing film on a substrate,the method including repeating a cycle a plurality of times, wherein thecycle includes: (a) supplying a metal-containing gas into a processingchamber where the substrate is accommodated; (b) supplying anitrogen-containing gas into the processing chamber; and (c) supplyingone of an oxygen-containing gas, a halogen-containing gas and acombination thereof into the processing chamber, wherein at least one ofthe steps (a) and (b) is performed while step (c) is performed.

Furthermore, in the semiconductor device manufacturing method, the steps(a) and (b) are alternately performed a plurality of times.

In addition, in the semiconductor device manufacturing method, the steps(a) and (b) are simultaneously performed.

Further, in the semiconductor device manufacturing method, an oxygencontent or a halogen content of the metal-containing film formed on thesubstrate is controlled in at least one of the steps (a), (b) and (c) tobe at a predetermined level.

Furthermore, there is provided a substrate processing apparatuscomprising: a processing chamber configured to accommodate a substrate;a gas supply system configured to supply a metal-containing gas, anitrogen-containing gas, and one selected from the group consisting ofan oxygen-containing gas, a halogen-containing gas and combinationsthereof into the processing chamber; and a controller configured tocontrol the gas supply system to perform: (a) supplying themetal-containing gas simultaneously with the one selected from the groupconsisting of the oxygen-containing gas, the halogen-containing gas andthe combinations thereof into the processing chamber; and (b) supplyingthe nitrogen-containing gas with the one selected from the groupconsisting of the oxygen-containing gas, the halogen-containing gas andthe combinations thereof into the processing chamber.

In addition, the present invention provides a substrate processingmethod of forming a metal-containing film on the substrate, the methodincluding: (a) supplying a metal-containing gas into a processingchamber where the substrate is accommodated; (b) supplying anitrogen-containing gas into the processing chamber; and (c) supplyingone of an oxygen-containing gas, a halogen-containing gas and acombination thereof into the processing chamber, wherein the step (a)and the step (b) are alternately performed a plurality of times, and thestep (c) is terminated only after the step (a) and the step (b) arealternately performed the plurality of times.

According to the present invention, it is possible to provide asemiconductor device manufacturing method and a substrate processingapparatus capable of increasing a value of a work function of a film tobe formed, in comparison with the related art.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a schematic configuration of asubstrate processing apparatus in accordance with a first exemplaryembodiment of the present invention;

FIG. 2 is a view showing a processing furnace included in the substrateprocessing apparatus shown in FIG. 1;

FIG. 3 is a cross-sectional view of the processing furnace taken alongline A-A of FIG. 2;

FIG. 4 is a view schematically showing a first gas supply system, asecond gas supply system and a third gas supply system included in thesubstrate processing apparatus shown in FIG. 1;

FIG. 5 is a block diagram showing a controller and members controlled bythe controller, which are included in the substrate processing apparatusshown in FIG. 1;

FIG. 6 is a flowchart showing an example of control in the firstembodiment of the present invention;

FIG. 7 is a timing chart showing a sequence of a film-forming process inthe first embodiment of the present invention;

FIG. 8 is a timing chart showing a first variant of the film-formingprocess in the first embodiment of the present invention;

FIG. 9 is a timing chart showing a second variant of the film-formingprocess in the first embodiment of the present invention;

FIG. 10 is a timing chart showing a third variant of the film-formingprocess in the first embodiment of the present invention;

FIG. 11 is a timing chart showing a fourth variant of the film-formingprocess in the first embodiment of the present invention;

FIG. 12 is a timing chart showing a fifth variant of the film-formingprocess in the first embodiment of the present invention;

FIG. 13 is a view schematically showing a first variant of the first gassupply system included in the substrate processing apparatus shown inFIG. 1;

FIG. 14 is a view schematically showing a second variant of the firstgas supply system included in the substrate processing apparatus shownin FIG. 1;

FIG. 15 is a view schematically showing a third variant of the first gassupply system included in the substrate processing apparatus shown inFIG. 1;

FIG. 16 is a view schematically showing a fourth variant of the firstgas supply system included in the substrate processing apparatus shownin FIG. 1;

FIG. 17 is a view schematically showing a fifth variant of the first gassupply system included in the substrate processing apparatus shown inFIG. 1;

FIG. 18 is a view schematically showing a variant of the third gassupply system included in the substrate processing apparatus shown inFIG. 1;

FIG. 19 is a view schematically showing a first gas supply system and asecond gas supply system included in a substrate processing apparatus inaccordance with a second exemplary embodiment of the present invention;

FIG. 20 is a view schematically showing a first variant of the first gassupply system and the second gas supply system included in the substrateprocessing apparatus in accordance with the second exemplary embodimentof the present invention; and

FIG. 21 is a view schematically showing a second variant of the firstgas supply system and the second gas supply system included in thesubstrate processing apparatus in accordance with the second exemplaryembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, an exemplary embodiment of the present invention will bedescribed with reference to the accompanying drawings. A substrateprocessing apparatus in accordance with the embodiment is configured asone example of a semiconductor manufacturing apparatus used inmanufacture of a semiconductor device (integrated circuits (IC)), and asemiconductor device manufacturing method is realized in the substrateprocessing apparatus in accordance with the embodiment. In the followingdescription, as one example of the substrate processing apparatus, thecase in which a vertical apparatus for performing film-formingprocessing of a substrate is used will be described. However, thepresent invention is not limited to the use of the vertical apparatus,but the present invention may use, for example, a sheet-feed typeapparatus.

FIG. 1 shows a substrate processing apparatus 101 in accordance with afirst embodiment of the present invention. As shown in FIG. 1, acassette 110 in which a wafer 200, which is an example of a substrate,is received is used in the substrate processing apparatus 101 and thewafer 200 is formed of a material such as silicon. The substrateprocessing apparatus 101 includes a housing 111, in which a cassettestage 114 is installed. The cassette 110 is loaded onto the cassettestage 114 or unloaded from the cassette stage 114 by a conveyanceapparatus (not shown) in process.

The cassette stage 114 is placed by a conveyance apparatus in processsuch that a wafer entrance of the cassette 110 is directed upward withthe wafer 200 in the cassette 110 held in a vertical posture. Thecassette stage 114 is operably configured to rotate the cassette 110rightward 90° in a longitudinal direction thereof at a rear side of thehousing 111 so that the wafer 200 in the cassette 110 is in a horizontalposture and the wafer entrance of the cassette 110 is directed to therear side of the housing 111.

A cassette shelf 105 is installed at substantially a center portion inthe housing 111 in a forward/rearward direction thereof, and thecassette shelf 105 is configured to store a plurality of cassettes 110in a multi-stage and a multi-column. A transfer shelf 123 in which thecassette 110 to be conveyed by a wafer transfer mechanism 125 isreceived is installed at the cassette shelf 105.

A preliminary cassette shelf 107 is installed over the cassette stage114 to preliminarily store the cassette 110.

A cassette conveyance apparatus 118 is installed between the cassettestage 114 and the cassette shelf 105. The cassette conveyance apparatus118 includes a cassette elevator 118 a that can be raised and loweredwith holding the cassette 110, and a cassette conveyance mechanism 118b, which is a conveyance mechanism. The cassette conveyance apparatus118 is configured to convey the cassette 110 between the cassette stage114, the cassette shelf 105 and the preliminary cassette shelf 107 by acontinuous operation of the cassette elevator 118 a and the cassetteconveyance mechanism 118 b.

The wafer transfer mechanism 125 is installed in rear of the cassetteshelf 105. The wafer transfer mechanism 125 includes a wafer transferapparatus 125 a configured to rotate or move the wafer 200 straight in ahorizontal direction, and a wafer transfer apparatus elevator 125 bconfigured to raise and lower the wafer transfer apparatus 125 a.Tweezers 125 c configured to pick up the wafer 200 are installed at thewafer transfer apparatus 125 a. The wafer transfer mechanism 125 isconfigured to charge the wafer 200 into a boat 217 or discharge thewafer 200 from the boat 217 using the tweezers 125 c as a mounting partof the wafer 200 by a continuous operation of the wafer transferapparatus 125 a and the wafer transfer apparatus elevator 125 b.

A processing furnace 202 configured to anneal the wafer 200 is installedat a rear upper side of the housing 111, and a lower end of theprocessing furnace 202 is configured to be opened/closed by a furnaceport shutter 147.

A boat elevator 115 configured to raise and lower the boat 217 withrespect to the processing furnace 202 is installed under the processingfurnace 202. An arm 128 is connected to an elevation frame of the boatelevator 115, and a seal cap 219 is horizontally installed at the arm128. The seal cap 219 is configured to close the lower end of theprocessing furnace 202 while vertically supporting the boat 217.

The boat 217 includes a plurality of holding members, and is configuredto horizontally hold a plurality of wafers 200 (for example, 50 to 150wafers) concentrically aligned in a vertical direction.

A clean unit 134 a configured to supply clean air, which is in a cleanatmosphere, is installed over the cassette shelf 105. The clean unit 134a includes a supply fan and an anti-vibration filter, and is configuredto flow the clean air into the housing 111.

A clean unit 134 b configured to supply clean air is installed at a leftend of the housing 111. The clean unit 134 b also includes a supply fanand an anti-vibration filter, and is configured to flow the clean airaround the wafer transfer apparatus 125 a, the boat 217, or the like.The clean air flows around the wafer transfer apparatus 125 a, the boat217, or the like, and then is exhausted to the outside of the housing111.

In the substrate processing apparatus 101 as configured above, when thecassette 110 is loaded onto the cassette stage 114 by the conveyanceapparatus (not shown) in process, the cassette 110 is placed such thatthe wafer 200 is held on the cassette stage 114 in a vertical postureand the wafer entrance of the cassette 110 is directed upward. Next, thecassette 110 is rotated rightward 90° in a longitudinal directionthereof at the rear side of the housing 111 such that the wafer 200 inthe cassette 110 is in a horizontal posture by the cassette stage 114and the wafer entrance of the cassette 110 is directed to the rear sideof the housing 111.

Thereafter, the cassette 110 is automatically conveyed and delivered toa designated shelf position of the cassette shelf 105 or the preliminarycassette shelf 107 by the cassette conveyance apparatus 118 to betemporarily stored, and then transferred to the transfer shelf 123 fromthe cassette shelf 105 or preliminary cassette shelf 107 by the cassetteconveyance apparatus 118 or directly conveyed to the transfer shelf 123.

When the cassette 110 is transferred to the transfer shelf 123, thewafer 200 is picked from the cassette 110 by the tweezers 125 c of thewafer transfer apparatus 125 a through the wafer entrance to be chargedinto the boat 217. The wafer transfer apparatus 125 a which deliveredthe wafer 200 to the boat 217 returns to the cassette 110 and chargesthe next wafer 200 to the boat 217.

When a predetermined number of wafers 200 are charged into the boat 217,the furnace port shutter 147 that closed the lower end of the processingfurnace 202 is opened to open the lower end of the processing furnace202. Next, the boat 217 in which a group of wafers 200 are held isloaded into the processing furnace 202 by a raising operation of theboat elevator 115, and the lower portion of the processing furnace 202is closed by the seal cap 219.

After the loading, the wafer 200 is arbitrarily processed in theprocessing furnace 202. After the processing, in a reverse sequence ofthat mentioned above, the wafer 200 and the cassette 110 are unloaded tothe outside of the housing 111.

In addition, the substrate processing apparatus 101 includes acontroller 900. The controller 900 is an example of a control unit(control unit) configured to control the entire operation of thesubstrate processing apparatus 101, and a CPU 932 (described later, seeFIG. 5), which is a portion of the controller 900, is installed in, forexample, the housing 111.

FIGS. 2 and 3 show the processing furnace 202. As shown in FIGS. 2 and3, the processing furnace 202 configures a processing chamber 201, whichis an example of a processing chamber configured to accommodate thewafer 200, and a heater 207, which is a heating apparatus (heating unit)configured to heat the wafer 200, is installed at the processing furnace202. The heater 207 includes an insulating member having a cylindricalshape with an upper side closed, and a plurality of heater wires, andhas a unit in which the heater wires are installed at the insulatingmember. A reaction tube 203 formed of quartz and configured to processthe wafer 200 is installed inside the heater 207.

The seal cap 219, which is a furnace port cover configured tohermetically close a lower end opening of the reaction tube 203, isinstalled under the reaction tube 203. The seal cap 219 is configured tocontact the lower end of the reaction tube 203 from a lower side thereofin the vertical direction. The seal cap 219 is formed of a metal such asstainless steel and has a disc shape. An O-ring, which is a seal memberin contact with the lower end of the reaction tube 203, is installed onan upper surface of the seal cap 219. A rotary mechanism 267 configuredto rotate the boat is installed at the seal cap 219 opposite to theprocessing chamber 201. A rotary shaft 255 of the rotary mechanism 267passes through the seal cap to be connected to the boat 217 (describedlater), and is configured to rotate the wafer 200 by rotation of theboat 217. The seal cap 219 is configured to be vertically raised andlowered by the boat elevator 115, which is an elevation mechanisminstalled outside the reaction tube 203, and thus, the boat 217 can beloaded into/unloaded from the inside of the processing chamber 201.

A boat support frame 218 configured to support the boat 217 is installedat the seal cap 219. The boat 217 includes a bottom plate 210 (seeFIG. 1) fixed to the boat support frame 218 and a top plate 211 disposedover the bottom plate 210, and a plurality of columns 212 (see FIG. 1)are installed between the bottom plate 210 and the top plate 211. Theplurality of wafers 200 are held on the boat 217. The plurality ofwafers 200 are supported by the columns 212 of the boat 217 atpredetermined intervals in a horizontal posture.

In the processing furnace 202 as described above, in a state in whichthe plurality of wafers 200, which are to be batch-processed, arestacked on the boat 217 in a multi-stage, the boat 217 is inserted intothe processing chamber 201 with the boat 217 supported by the boatsupport frame 218, and the heater 207 heats the wafer 200 inserted intothe processing chamber 201 to a predetermined temperature.

A temperature sensor 263, which is a temperature detector, is installedin the reaction tube 203, and is configured such that a temperature inthe processing chamber 201 arrives at a desired temperature distributionby adjusting a conduction state to the heater 207 based on temperatureinformation detected by the temperature sensor 263. The temperaturesensor 263 has an L shape and is installed along an inner wall of thereaction tube 203.

The boat 217 is installed at a center portion in the reaction tube 203.The boat 217 is raised and lowered (goes in/come out) with respect tothe reaction tube 203 by the boat elevator 115. A boat rotary mechanism267 configured to rotate the boat 217 to improve processing uniformityis installed at a lower end of the boat support frame 218 configured tosupport the boat 217. As the boat rotary mechanism 267 is driven, theboat 217 supported by the boat support frame 218 can be rotated.

In addition, as shown in FIGS. 2 and 3, the substrate processingapparatus 101 includes a first gas supply system 300, a second gassupply system 400 and a third gas supply system 500.

The first gas supply system 300 is used as one example of a first gassupply system configured to supply a metal-containing gas into theprocessing chamber 201, and includes a first gas supply pipe 310. Oneend of the first gas supply pipe 310 is disposed inside the processingchamber 201, and the other end is disposed outside the processingchamber 201. In addition, the first gas supply system 300 includes afirst nozzle 314.

The first nozzle 314 is connected to the one end of the first gas supplypipe 310, and extends in an arc-shaped space between the inner wall ofthe reaction tube 203 and the wafer 200, which constitute the processingchamber 201, in a vertical direction along the inner wall of thereaction tube 203 (in a stack direction of the wafers 200). Further, aplurality of gas supply holes 314 a configured to supply ametal-containing gas are formed in a side surface of the first nozzle314. The gas supply holes 314 a having the same opening size orgradually varied opening areas are formed in the first nozzle 314 from alower portion to an upper portion thereof at predetermined openingpitches.

The second gas supply system 400 is used as a second gas supply systemconfigured to supply a nitrogen-containing gas into the processingchamber 201, and includes a second gas supply pipe 410. One end of thesecond gas supply pipe 410 is disposed inside the processing chamber201, and the other end is disposed outside the processing chamber 201.In addition, the second gas supply system 400 includes a second nozzle414.

The second nozzle 414 is connected to one end of the second gas supplypipe 410, and extends in an arc-shaped space between the inner wall ofthe reaction tube 203 and the wafer 200, which constitute the processingchamber 201, in the vertical direction along the inner wall of thereaction tube 203 (in the stack direction of the wafers 200). Inaddition, a plurality of gas supply holes 414 a configured to supply anitrogen-containing gas are formed in a side surface of the secondnozzle 414. The gas supply holes 414 a having the same opening size orgradually varied opening areas are formed in the second nozzle 414 froma lower portion to an upper portion thereof at predetermined openingpitches.

The third gas supply system 500 is used as a third gas supply systemconfigured to supply one of an oxygen-containing gas, ahalogen-containing gas and a combination thereof into the processingchamber 201, and includes a third gas supply pipe 510. One end of thethird gas supply pipe 510 is disposed inside the processing chamber 201,and the other end is disposed outside the processing chamber 201. Inaddition, the third gas supply system 500 includes a third nozzle 514.

The third nozzle 514 is connected to the one end of the third gas supplypipe 510, and extends in an arc-shaped space between the inner wall ofthe reaction tube 203 and the wafer 200, which constitute the processingchamber 201, in the vertical direction along the inner wall of thereaction tube 203 (in the stack direction of the wafers 200). Inaddition, a plurality of gas supply holes 514 a configured to supply anoxygen-containing gas are formed in a side surface of the third nozzle514. The gas supply holes 514 a having the same opening size orgradually varied opening areas are formed in the third nozzle 514 from alower portion to an upper portion thereof at predetermined openingpitches.

FIG. 4 shows the first gas supply system 300, the second gas supplysystem 400 and the third gas supply system 500.

As shown in FIG. 4, the first gas supply system 300 includes the firstgas supply pipe 310, a bubbler 700 connected to the gas supply pipe 310,and a valve 318 installed in the gas supply pipe 310 at an upstream sideof the bubbler 700.

The bubbler 700 includes an accommodating vessel 702 configured toaccommodate a liquid source material, and is used as one example of anevaporator configured to generate a source gas by evaporating the liquidsource material through bubbling. The accommodating vessel 702 is asealed vessel, and TiCl₄ (titanium tetrachloride), which is an exampleof the liquid source material, is accommodated in the accommodatingvessel 702.

A carrier gas supply pipe 360 is connected to the accommodating vessel702. A carrier gas supply source (not shown) is connected to an upstreamside of the carrier gas supply pipe 360. In addition, a downstream sideend of the carrier gas supply pipe is immersed in the liquid sourcematerial accommodated in the accommodating vessel 702. Further, a massflow controller 362 configured to control a supply flow rate of acarrier gas supplied from a carrier gas supply source and a valve 364used to stop or initiate supply of the carrier gas are mounted on thecarrier gas supply pipe 360.

A gas that does not react with the liquid source material may be used asthe carrier gas supplied using the carrier gas supply pipe 360, forexample, an inert gas such as N₂ gas or Ar gas may be used.

The valve 318 is used to stop or initiate supply of the source gas fromthe bubbler 700.

In addition, the first gas supply system 300 includes a carrier gassupply pipe 330, a mass flow controller 332 and a valve 334. The carriergas supply pipe 330 is used to supply a carrier gas, and is connected tothe first gas supply pipe 310. The mass flow controller 332 and thevalve 334 are mounted on the carrier gas supply pipe 330 in a sequenceof the mass flow controller 332 and the valve 334 from an upstream side.For example, N₂ gas is used as the carrier gas supplied through thecarrier gas supply pipe 330.

Further, the first gas supply system 300 includes a cleaning gas supplypipe 340, a mass flow controller 342, a valve 344 and a valve 346. Thecleaning gas supply pipe 340 is used to supply a cleaning gas, andconnected to the first gas supply pipe 310 at a downstream side of aposition to which the bubbler 700 is connected. The mass flow controller342, the valve 344 and the valve 346 are mounted on the cleaning gassupply pipe 340 in a sequence of the mass flow controller 342, the valve344 and the valve 346 from an upstream side.

Furthermore, the first gas supply system 300 includes a valve 350. Thevalve 350 is mounted on the first gas supply pipe 310 at a downstreamside of a position to which the carrier gas supply pipe 330 is connectedand an upstream side of a position to which the cleaning gas supply pipe340 is connected.

The first gas supply system 300 configured as above supplies TiCl₄ gas,which is an example of a metal-containing gas, into the processingchamber 201. Instead of the configuration of the first gas supply system300 to supply TiCl₄ gas into the processing chamber 201, the first gassupply system 300 may be configured to supplytetrakisdimethylaminotitanium (TDMAT, Ti[N(CH₃)₂]₄) ortetrakisdiethylaminotitanium (TDEAT, Ti[N(CH₂CH₃)₂]₄) into theprocessing chamber 201.

The second gas supply system 400 includes the second gas supply pipe410, a mass flow controller 416 and a valve 418. A supply source of NH₃(ammonia) gas (not shown) is connected to an upstream side end of thesecond gas supply pipe 410. The mass flow controller 416 and the valve418 are mounted on the second gas supply pipe 410 in a sequence of themass flow controller 416 and the valve 418 from an upstream side. Themass flow controller 416 is used as an example of a flow rate controlapparatus (flow rate control unit), and the valve 418 is used as anexample of an opening/closing valve.

In addition, the second gas supply system 400 includes a carrier gassupply pipe 430, a mass flow controller 432 and a valve 434. The carriergas supply pipe 430 is used to supply a carrier gas and connected to thesecond gas supply pipe 410. The mass flow controller 432 and the valve434 are mounted on the carrier gas supply pipe 430 in a sequence of themass flow controller 432 and the valve 434 from an upstream side. Forexample, N₂ gas is used as the carrier gas supplied through the carriergas supply pipe 430.

Further, the second gas supply system 400 includes a cleaning gas supplypipe 440, a mass flow controller 442, a valve 444 and a valve 446. Thecleaning gas supply pipe 440 is used to supply a cleaning gas and isconnected to the second gas supply pipe 410. The mass flow controller442, the valve 444 and the valve 446 are mounted on the cleaning gassupply pipe 440 in a sequence of the mass flow controller 442, the valve444 and the valve 446 from an upstream side.

In addition, the second gas supply system 400 includes a valve 450. Thevalve 450 is mounted on the second gas supply pipe 410 at a downstreamside of a position to which the carrier gas supply pipe 430 is connectedand an upstream side of a position to which the cleaning gas supply pipe440 is connected.

The second gas supply system 400 configured as above supplies NH₃ gas,which is an example of a nitrogen-containing gas, into the processingchamber 201. Instead of the configuration of the second gas supplysystem 400 to supply the NH₃ gas into the processing chamber 201, thesecond gas supply system 400 may be configured to supply N₂ (nitrogen)gas, N₂O (nitrous oxide) gas, CH₆N₂ (monomethylhydrazine) gas, etc.,into the processing chamber 201.

The third gas supply system 500 includes the third gas supply pipe 510,a mass flow controller 516 and the valve 518. A supply source of O₂(oxygen) gas is connected to an upstream side end of the third gassupply pipe 510. The mass flow controller 516 and the valve 518 aremounted on the third gas supply pipe 510 in a sequence of the mass flowcontroller 516 and the valve 518 from an upstream side. The mass flowcontroller 516 is used as one example of the flow rate control apparatus(flow rate control unit), and the valve 518 is used as anopening/closing valve. Instead of the configuration of the third gassupply system 500 to supply the O₂ gas into the processing chamber 201,the third gas supply system 500 may be configured to supply the N₂O(nitrous oxide) gas, etc., into the processing chamber 201.

Further, the third gas supply system 500 includes a carrier gas supplypipe 530, a mass flow controller 532 and a valve 534. The carrier gassupply pipe 530 is used to supply a carrier gas and is connected to thethird gas supply pipe 510. The mass flow controller 532 and the valve534 are mounted on the carrier gas supply pipe 530 in a sequence of themass flow controller 532 and the valve 534 from an upstream side. Forexample, N₂ gas is used as the carrier gas supplied through the carriergas supply pipe 530.

Furthermore, the third gas supply system 500 includes a cleaning gassupply pipe 540, a mass flow controller 542, a valve 544 and a valve546. The cleaning gas supply pipe 540 is used to supply a cleaning gasand connected to the third gas supply pipe 510. The mass flow controller542, the valve 544 and the valve 546 are mounted on the cleaning gassupply pipe 540 in a sequence of the mass flow controller 542, the valve544 and the valve 546 from an upstream side.

In addition, the third gas supply system 500 includes a valve 550. Thevalve 550 is mounted on the third gas supply pipe 510 at a downstreamside of a position to which the carrier gas supply pipe 530 is connectedand an upstream side of a position to which the cleaning gas supply pipe540 is connected.

A gas supply method in the embodiment is clearly distinguished from theconventional method of directly supplying a gas from one end of a lowerside or an upper side of the reaction tube 203 into an arc-shapedelongated space defined by the inner wall of the reaction tube 203 andends of the plurality of wafers 200 to flow the gas from the lower sideto the upper side or from the upper side to the lower side so that eachof the wafers 200 stacked in the reaction tube 203 reacts with theflowing gas. In this case, at an area adjacent to a gas supply part, theamount of gas is relatively increased (a concentration of the gas isrelatively increased), and a film thickness of the thin film formed onthe wafer 200 disposed at the area is increased. Meanwhile, at an areafar away from the gas supply part, since the amount of gas that canarrive at the wafer 200 is reduced (the concentration of the gas isrelatively increased), the film thickness of the thin film formed on thewafer 200 disposed at the area is reduced. Accordingly, since adifference in film thickness of the thin film generated between upperand lower sides of the wafers 200 stacked in the reaction tube 203occurs, the conventional gas supply method is not preferable to avertical batch-type apparatus.

Meanwhile, the gas supply method in the embodiment is characterized inthat a gas is conveyed via the nozzles 314, 414 and 514 disposed in thearc-shaped space, the gas is initially ejected into the reaction tube203 and around the wafer 200 through the gas supply hole 314 a, 414 aand 514 a opened at the nozzle 314, 414 and 514, and a main flow of thegas in the reaction tube 203 is parallel to a surface of the wafer 200,i.e., a horizontal direction. As a result, the gas can be uniformlysupplied to each of the wafers 200, and the film thickness of the thinfilm formed on each of the wafers 200 can be uniformized. In addition,while the remaining gas after the reaction flows toward an exhaust port.i.e., in a direction of an exhaust pipe 231, which will be describedlater, the flow direction of the remaining gas is not limited to thevertical direction but may be appropriately specified by a position ofthe exhaust port.

The exhaust pipe 231 configured to exhaust an atmosphere in theprocessing chamber 201 is installed at the reaction tube 203. As shownin FIG. 3, when seen from a lateral cross-sectional view, the exhaustpipe 231 is installed at a side of the reaction tube 203 opposite to aside in which the gas supply hole 314 a of the first nozzle 314, the gassupply hole 414 a of the second nozzle 414 and the gas supply hole 514 aof the third nozzle 514 are formed, i.e., an opposite side of the gassupply holes 314 a, 414 a and 514 a with the wafer 200 interposedtherebetween. In addition, the exhaust pipe 231 is installed underpositions in which the gas supply holes 314 a, 414 a and 515 a areformed. According to the configuration, the gas supplied around thewafer 200 in the processing chamber 201 through the gas supply holes 314a. 414 a and 514 a flows in a horizontal direction, i.e., in a directionparallel to the surface of the wafer 200, flows downward, and then isexhausted through the exhaust pipe 231. Similar to that described above,a main flow of the gas in the processing chamber 201 becomes a flow in ahorizontal direction. A vacuum pump 246, which is a vacuum exhaustapparatus, is connected to the exhaust pipe 231 via a pressure sensor245, which is a pressure detector (a pressure detecting part) configuredto detect a pressure in the processing chamber 201, and an automaticpressure controller (APC) valve 243, which is a pressure regulator (apressure regulating part), so that the pressure in the processingchamber 201 is vacuum-exhausted to a predetermined pressure (a degree ofvacuum). In addition, the APC valve 243 is an opening/closing valveconfigured to open/close a valve to perform the vacuum-exhaust and stopthe vacuum-exhaust in the processing chamber 201, and adjust a valveopening angle to regulate the pressure. An exhaust system is mainlyconstituted by the exhaust pipe 231, the APC valve 243, the vacuum pump246 and the pressure sensor 245.

FIG. 5 shows the controller 900. The controller 900 controls the firstgas supply system 300, the second gas supply system 400 and the thirdgas supply system 500 such that an oxygen content or a halogen contentincluded in the metal-containing film formed on the wafer 200 is at apredetermined level.

In addition, the controller 900 includes a display 910 configured todisplay operation menus, and an operation input part 902 having aplurality of keys and into which various information and operationorders are input. Further, the controller 900 includes a CPU 932configured to process the entire operation of the substrate processingapparatus 101, a ROM 934 in which various programs including a controlprogram are previously stored, a RAM 936 configured to temporarily storevarious data, an HDD 938 configured to store and hold various data, adisplay driver 912 configured to control display of various informationto the display 910 and receive operation information from the display910, an operation input detection part 922 configured to detect anoperation state of the operation input part 920, and a communicationinterface (I/F) part 940.

The communication I/F part 940 performs transmission and reception ofvarious information to/from various members such as a temperaturecontrol unit 950 (described later), a pressure control unit 960(described later), the vacuum pump 246, the boat rotary mechanism 267,the boat elevator 115, the mass flow controllers 322, 342, 362, 416,432, 442, 516, 532 and 542, and a valve control unit 970 (describedlater).

The CPU 932, the ROM 934, the RAM 936, the HDD 938, the display driver912, the operation input detection part 922 and the communication I/Fpart 940 are connected to each other via a system bus 904. For thisreason, the CPU 932 can perform access to the ROM 934, the RAM 936 andthe HDD 938, control of display of various information to the display910 via the display driver 912 and recognition of operation informationfrom the display 910, and control of transmission and reception ofvarious information to/from each member via the communication I/F part940. In addition, the CPU 932 can recognize an operation state of a usewith respect to the operation input part 920 via the operation inputdetection part 922.

The temperature control unit 950 includes the heater 207, a heatingpower source 250 configured to supply power to the heater 207, thetemperature sensor 263, a communication I/F part 952 configured totransmit and receive various information such as set temperatureinformation to/from the controller 900, and a heater control unit 292configured to control power supply from the heating power source 250 tothe heater 207 based on the received set temperature information and thetemperature information from the temperature sensor 263. The heatercontrol unit 292 is realized by a computer. The communication I/F part952 of the temperature control unit 950 is connected to thecommunication I/F part 940 of the controller 900 via a cable.

The pressure control unit 960 includes the APC valve 243, the pressuresensor 245, a communication I/F part 962 configured to transmit andreceive various information such as set pressure information andopening/closing information of the APC valve 243 to/from the controller900, and an APC valve control unit 964 configured to controlopening/closing or an opening angle of the APC valve 243 based on theset pressure information, opening/closing information of the APC valve243, and pressure information from the pressure sensor 245. The APCvalve control unit 964 is realized by the computer. The communicationI/F part 962 of the pressure control unit 960 is connected to thecommunication I/F part 940 of the controller 900 via a cable.

The valve control unit 970 includes the valves 318, 334, 344, 346, 350,364, 428, 444, 446, 450, 518, 534, 544, 546 and 550, and anelectromagnetic valve group 972 configured to control supply of air tothe valves 318, 334, 344, 346, 350, 364, 428, 444, 446, 450, 518, 534,544, 546 and 550, which are air valves. The electromagnetic valve group972 is connected to the communication I/F part 940 of the controller 900via a cable.

As described above, the controller 900 is connected to each of themembers such as the mass flow controllers 332, 342, 362, 416, 432 and442, the valves 318, 334, 344, 346, 350, 364, 418, 444, 446, 450, 518,534, 544, 546 and 550, the APC valve 243, the heating power source 250,the temperature sensor 263, the pressure sensor 245, the vacuum pump246, the boat rotary mechanism 267 and the boat elevator 115. Inaddition, the controller 900 is configured to perform a flow ratecontrol of the mass flow controllers 332, 342, 362, 416, 432 and 442, anopening/closing operation control of the valves 318, 334, 344, 346, 350,364, 418, 444, 446, 450, 518, 534, 544, 546 and 550, a pressure controlthrough an opening angle adjusting operation based on pressureinformation from the pressure sensor 245, a temperature control througha power supply amount adjusting operation from the heating power source250 to the heater 207 based on temperature information from thetemperature sensor 263, an initiation and stoppage control of the vacuumpump 246, a rotational speed adjusting control of the boat rotarymechanism 267, and an elevation operation control of the boat elevator115.

Hereinafter, an example of a method of forming a film on a substratewhen a large scale integration (LSI) is manufactured, which is oneprocess of manufacturing a semiconductor device, using the processingfurnace 202 of the substrate processing apparatus will be described. Inaddition, in the following description, operations of the membersconstituting the substrate processing apparatus are controlled by thecontroller 900.

In the embodiment, a method of forming a titanium oxynitride (TiON)film, in which oxygen is added (doped) to a titanium nitride film, whichis a metal film, on a substrate using a method of alternately supplyinga plurality of processing gases will be described. In the embodiment,for example, TiCl₄ is used as a titanium (Ti)-containing element and NH₃is used as a nitriding gas. In the example, a titanium-containing gassupply system (a first element-containing gas supply system) isconstituted by the first gas supply system 300, a nitrogen-containinggas supply system (a second element-containing gas supply system) isconstituted by the second gas supply system 400, and anoxygen-containing gas supply system (a third element-containing gassupply system) is constituted by a third gas supply system 500.

FIG. 6 shows an example of a control flow in the embodiment. The firstgas supply system 300, the second gas supply system 400 and the thirdgas supply system 500 are controlled by the control flow such that anoxygen content or a halogen content included in the metal-containingfilm formed on the wafer 200 is at a predetermined level. In addition,in the control flow, the controller 900 controls the substrateprocessing apparatus 101 as follows. That is, the heater 207 iscontrolled to maintain the inside of the processing chamber 201 at atemperature of, for example, 300° C. to 550° C., preferably, 450° C. orless, and more preferably, 450° C.

In addition, wafer charging is performed in step S102. That is, theplurality of wafers 200 are charged into the boat 217.

In the following step S104, boat loading is performed. That is, the boat217 on which the plurality of wafers 200 are supported is raised by theboat elevator 115 to be loaded into the processing chamber 201. In thisstate, the seal cap 219 seals the lower end of the reaction tube 203 viaan O-ring 220. Next, the boat 217 is rotated by a boat driving mechanism267 to rotate the wafer 200. Next, as the vacuum pump 246 is operated,the APC valve 243 is opened to vacuum-exhaust the inside of theprocessing chamber 201, and when a temperature of the wafer 200 arrivesat 450° C. and is stably maintained (pressure and temperatureadjustment, S106), the next steps are sequentially performed in a statein which the temperature in the processing chamber 201 is maintained at450° C.

In step (S202), TiCl₄ is supplied. TiCl₄ is a liquid at a normaltemperature. For this reason, in order to supply it into the processingchamber 201, N₂ (nitrogen), which is an inert gas, used as one exampleof a carrier gas passes through the accommodating vessel 702 using thebubbler 700, and is supplied into the processing chamber 201 with thecarrier gas to an extent of evaporation. Instead of N₂, He (helium), Ne(neon) and Ar (argon) may be used as the carrier gas.

More specifically, in step S202, the TiCl₄ flows through the first gassupply pipe 310 and the carrier gas (N₂) flows through the carrier gassupply pipe 330. At this time, the valve 362, the valve 318 of the firstgas supply pipe 310, the valve 334 of the carrier gas supply pipe 330and the APC valve 243 of the exhaust pipe 231 are opened together. Thecarrier gas flows through the carrier gas supply pipe 330 to be flowrate-controlled by the mass flow controller 332. The TiCl₄ flows throughthe first gas supply pipe 310 to be flow rate-adjusted through the massflow controller 362 by adjusting a flow rate of the carrier gas suppliedinto the accommodating vessel 702, mixed with the flow rate-adjustedcarrier gas, supplied into the processing chamber 201 through the gassupply hole 314 a of the first nozzle 314 to flow on the surface of thewafer 200 in a horizontal direction, and then exhausted through theexhaust pipe 231. Here, a main flow of the gas in the processing chamber201 becomes a flow in a horizontal direction, i.e., in a directionparallel to the surface of the wafer 200. In addition, at this time, theAPC valve 243 is appropriately adjusted to maintain the pressure in theprocessing chamber 201 within a range of 20 to 50 Pa, for example, 30Pa. A supply amount of TiCl₄ controlled by the mass flow controller 362is, for example, 1.0 to 2.0 g/min. A time of exposing the wafer 200 tothe TiCl₄ is about 3 to 10 seconds. Here, the temperature of the heater207 is set such that the temperature of the wafer is within a range of300° C. to 550° C. for example, 450° C.

In step S202, the gas flowing into the processing chamber 201 containsTiCl₄ and N₂, which is an inert gas, and there is no NH₃. Accordingly.TiCl₄ does not cause a gas phase reaction but surface-reacts with asurface or a lower base film of the wafer 200.

In step S202, when the valve 434 is opened and the inert gas flowsthrough the carrier gas supply pipe 430 connected to the middle of thesecond gas supply pipe 410, TiCl₄ can be prevented from entering the NH₃side. In addition, when the valve 534 is opened and the inert gas flowsthrough the carrier gas supply pipe 530 connected to the middle of thethird gas supply pipe 510, TiCl₄ can be prevented from entering the O₂side.

In the next step S204, the remaining gas is removed. That is, in a statein which the valve 318 of the first gas supply pipe 310 is closed tostop supply of the TiCl₄ into the processing chamber 201 and the APCvalve 243 of the exhaust pipe 231 is opened, the inside of theprocessing chamber 201 is exhausted by the vacuum pump 246 to 20 Pa orless, and the remaining TiCl₄ is eliminated from the inside of theprocessing chamber 201. In addition, here, the gas remaining in theprocessing chamber 201 may not be completely eliminated, and the insideof the processing chamber 201 may not be completely purged. When anamount of the gas remaining in the processing chamber 201 is very small,there is no bad influence on step 2 performed thereafter. Here, there isno need to increase a flow rate of N₂ gas supplied into the processingchamber 201 to a large flow rate. For example, as substantially the sameamount of gas as a volume of the reaction tube 203 (the processingchamber 201) is supplied, the purge can be performed to an extent inwhich there is no bad influence on step S206. As described above, as theinside of the processing chamber 201 is not completely purged, the purgetime can be reduced and throughput can be improved. In addition,consumption of the N₂ gas can be suppressed to a minimum level.

In the next step S206, NH₃ is supplied. That is, the NH₃ flows throughthe second gas supply pipe 410 and the carrier gas (N₂) flows throughthe carrier gas supply pipe 430. Here, the valve 418 of the second gassupply pipe 410, the valves 434 and 450 of the carrier gas supply pipe430 and the APC valve 243 of the exhaust pipe 231 are opened together.The carrier gas flows through the carrier gas supply pipe 430 to be flowrate-adjusted by the mass flow controller 432. The NH₃ flows through thesecond gas supply pipe 410 to be flow rate-adjusted by the mass flowcontroller 416, is mixed with the flow rate-adjusted carrier gas to besupplied into the processing chamber 201 through the gas supply hole 414a of the second nozzle 414, flows on the wafer 200 in a horizontaldirection, and then is exhausted through the exhaust pipe 231. Here, amain flow of the gas in the processing chamber 201 becomes a flow in ahorizontal direction. i.e., in a direction parallel to the surface ofthe wafer 200. In addition, when the NH₃ flows, the APC valve 243 isappropriately adjusted to maintain the pressure in the processingchamber 201 within a range of 50 to 1000 Pa, for example, 60 Pa. Asupply flow rate of the NH₃ controlled by the mass flow controller 416is within a range of, for example, 1 to 10 slm. A time of exposing thewafer 200 to NH₃ is for example, 10 to 30 seconds. The temperature ofthe heater 207 at this time is a predetermined temperature within arange of 300° C. to 550° C., for example, 450° C.

In step S206, when the valve 334 is opened to flow an inert gas throughthe carrier gas supply pipe 330 connected to the middle of the first gassupply pipe 310, the NH₃ can be prevented from entering the TiCl₄ side.In addition, when the valve 534 is opened to flow the inert gas throughthe carrier gas supply pipe 530 connected to the middle of the third gassupply pipe 510, the NH₃ can be prevented from entering the O₂ side.

In step S206, as the NH: is supplied, the TiCl₄ and NH₃ are reacted witheach other on the wafer 200 to form a titanium nitride (TiN) film on thewafer 200.

In the next step S208, the remaining gas is removed. That is, the valve418 of the second gas supply pipe 410 is closed to stop supply of theNH₃. In addition, in a state in which the APC valve 243 of the exhaustpipe 231 is kept open, the processing chamber 201 is exhausted by thevacuum pump 246 to 20 Pa or less, and the remaining NH₃ is eliminatedfrom the processing chamber 201. In addition, here, the gas remaining inthe processing chamber 201 may not be completely eliminated, and theinside of the processing chamber 201 may not be completely purged. Whenan amount of the gas remaining in the processing chamber 201 is verysmall, there is no bad influence on step S210 performed thereafter.Here, there is no need to increase a flow rate of N₂ gas supplied intothe processing chamber 201 to a large flow rate. For example, assubstantially the same amount of gas as a volume of the reaction tube203 (the processing chamber 201) is supplied, the purge can be performedto an extent in which there is no bad influence on step S210. Asdescribed above, as the inside of the processing chamber 201 is notcompletely purged, the purge time can be reduced and throughput can beimproved. In addition, consumption of the N₂ gas can be suppressed to aminimum level.

In the next step S210, O₂ is supplied. That is, the O₂ flows through thethird gas supply pipe 510, and the carrier gas (N₂) flows through thecarrier gas supply pipe 530. At this time, the valves 518 and 550 of thethird gas supply pipe 510, the valves 534 and 550 of the carrier gassupply pipe 530 and the APC valve 243 of the exhaust pipe 231 are openedtogether. The carrier gas flows through the carrier gas supply pipe 530to be flow rate-adjusted by the mass flow controller 532. The O₂ flowsthrough the third gas supply pipe 510 to be flow rate-adjusted by themass flow controller 516, is mixed with the flow rate-adjusted carriergas to be supplied into the processing chamber 201 through the gassupply hole 514 a of the third nozzle 514, flows on the surface of thewafer 200 in a horizontal direction, and then is exhausted through theexhaust pipe 231. Here, a main flow of the gas in the processing chamber201 becomes a flow in a horizontal direction, i.e., in a directionparallel to the surface of the wafer 200. When the O₂ flows, the APCvalve 243 is appropriately adjusted to maintain the pressure in theprocessing chamber 201 within a range of 50 to 1,000 Pa, for example, 60Pa.

In step S210, when the valve 334 is opened to flow the inert gas throughthe carrier gas supply pipe 330 connected to the middle of the first gassupply pipe 310, the O₂ can be prevented from entering the TiCl₄ side.In addition, when the valve 434 is opened to flow the inert gas throughthe carrier gas supply pipe 430 connected to the middle of the secondgas supply pipe 410, the O₂ can be prevented from entering the NH₃ side.

In step S210, As the O₂ is supplied onto the titanium nitride (TiN)film, a titanium oxynitride (TiON) film is formed on the substrate. TheTiON film has a higher work function than the TiN film. For this reason,for example, while Ru (ruthenium) has a much higher work function thanTi, the film having a relatively high work function can be formed, withno use of an expensive material.

In the next step S212, the remaining gas is removed. That is, the valve518 of the third gas supply pipe 510 is closed to stop supply of the O₂.In addition, in a state in which the APC valve 243 of the exhaust pipe231 is kept open, the processing chamber 201 is exhausted by the vacuumpump 246 to 20 Pa or less to eliminate the remaining O₂ from theprocessing chamber 201. In addition, here, the gas remaining in theprocessing chamber 201 may not be completely eliminated, and the insideof the processing chamber 201 may not be completely purged. When anamount of the gas remaining in the processing chamber 201 is very small,there is no bad influence on the next gas supply step. Here, there is noneed to increase a flow rate of N₂ gas supplied into the processingchamber 201 to a large flow rate. For example, as substantially the sameamount of gas as a volume of the reaction tube 203 (the processingchamber 201) is supplied, the purge can be performed to an extent inwhich there is no bad influence on the next gas supply step. Asdescribed above, as the inside of the processing chamber 201 is notcompletely purged, the purge time can be reduced and throughput can beimproved. In addition, consumption of the N₂ gas can be suppressed to aminimum level.

In the next step S220, it is determined whether a series of steps fromS202 to S212 have been performed a predetermined number of times. Whenit is determined that the steps have been performed the predeterminednumber of times, the next step S402 is performed, and when it isdetermined that the steps have not been performed the predeterminednumber of times, the process returns to step S202.

In the film-forming process including steps S202 to S212 as describedabove, the TiON film is formed.

In the next step S402, the purge is performed (purging). In the nextstep S404, returning to an atmospheric pressure is performed. That is,the atmosphere in the processing chamber 201 is replaced with the inertgas, and the pressure in the processing chamber 201 returns to thenormal pressure (returning to the atmospheric pressure).

In the next step S406, boat unloading is performed. That is, the sealcap 219 is lowered by the boat elevator 115 to open the lower end of thereaction tube 203, and simultaneously, the processed wafer 200 supportedon the boat 217 is unloaded from the lower end of the reaction tube 203to the outside of the reaction tube 203 (boat unloading).

In the next step S408, wafer discharging is performed. That is, theprocessed wafer 200 is discharged from the boat 217 (wafer discharging).As described above, one film-forming processing (batch processing) iscompleted. In addition, after the completion of the film-formingprocessing, a cleaning gas may be appropriately supplied according to anamount of byproducts stuck to the inside of the reaction tube 203 toperform gas cleaning.

FIG. 7 is a timing chart showing a film-forming sequence of the TiONfilm in the film-forming process. The sequence corresponds to steps S202to S220. As shown in FIG. 7, in the film-forming process, a process ofsupplying TiCl₄ gas, which is a metal-containing gas, a process ofsupplying NH₃ gas, which is a nitrogen-containing gas, and a process ofsupplying O₂ gas, which is an oxygen-containing gas, are set as onecycle, and the cycle is repeated a predetermined number of times. Here,the number of cycles is determined according to a film thickness of afilm to be formed, for example, when a film-forming rate is 1 Å/cycle, afilm of 20 Å can be formed by performing 20 cycles.

FIG. 8 is a timing chart showing a first variant of the film-formingsequence in the film-forming process in accordance with the embodiment.In the film-forming sequence of the TiON film in the film-formingprocess in accordance with the embodiment, the process of supplyingTiCl₄ gas, which is a metal-containing gas, the process of supplying NH₃gas, which is a nitrogen-containing gas, and the process of supplying O₂gas, which is an oxygen-containing gas, were set as one cycle, and thecycle was repeated a predetermined number of times. On the other hand,in the first variant, a process of supplying TiCl₄ gas, which is ametal-containing gas, and a process of supplying NH₃ gas, which is anitrogen-containing gas, are set as one cycle, the cycle is repeated aplurality of times (3 times in the first variant), and then a process ofsupplying O₂ gas, which is an oxygen-containing gas, is performed.

In addition, in the first variant, the process of supplying TiCl₄ gas,which is a metal-containing gas, and the process of supplying NH₃ gas,which is a nitrogen-containing gas, are set as one cycle, the cycle isperformed a plurality of times (3 times in the first variant) and thenthe process of supplying O₂ gas, which is an oxygen-containing gas, isperformed, the series of processes are set as one cycle, and the cycleincluding the series of processes is repeated a plurality of times.

The first variant of the film-forming sequence in the film-formingprocess is realized by controlling the respective members of thesubstrate processing apparatus 101 using the controller 900.

FIG. 9 is a timing chart showing a second variant of the film-formingsequence in the film-forming process in accordance with the embodiment.In the film-forming sequence of the TiON film in the film-formingprocess in accordance with the embodiment, the process of supplyingTiCl₄ gas, which is a metal-containing gas, the process of supplying NH₃gas, which is a nitrogen-containing gas, and the process of supplying O₂gas, which is an oxygen-containing gas, were set as one cycle, and thecycle was repeated a predetermined number of times. On the other hand,in the second variant, a process of supplying TiCl₄ gas, which is ametal-containing gas, and a process of supplying NH₃ gas, which is anitrogen-containing gas, are set as one cycle, the cycle is repeated aplurality of times (20 times in the first variant), and then a processof supplying O₂ gas, which is an oxygen-containing gas, is performed,completing a series of film-forming processes.

The second variant of the film-forming sequence in the film-formingprocess is realized by controlling the respective members of thesubstrate processing apparatus 101 using the controller 900.

FIG. 10 is a timing chart showing a third variant of the film-formingsequence in the film-forming process in accordance with the embodiment.In the film-forming sequence of the TiON film in the film-formingprocess in accordance with the embodiment, the process of supplyingTiCl₄ gas, which is a metal-containing gas, the process of supplying NH₃gas, which is a nitrogen-containing gas, and the process of supplying O₂gas, which is an oxygen-containing gas, were set as one cycle, and thecycle was repeated a predetermined number of times. On the other hand,in the third variant, a process of supplying TiCl₄ gas, which is ametal-containing gas, and a process of supplying NH₃ gas, which is anitrogen-containing gas, are performed while a process of supplying O₂gas, which is an oxygen-containing gas, is performed.

In addition, in the third variant, the process of supplying TiCl₄ gas,which is a metal-containing gas, and the process of supplying NH₃ gas,which is a nitrogen-containing gas, are set as one cycle, and the cycleis performed a plurality of times (20 times in the third variant).

The third variant of the film-forming sequence in the film-formingprocess is realized by controlling the respective members of thesubstrate processing apparatus 101 using the controller 900.

FIG. 11 is a timing chart showing a fourth variant of the film-formingsequence in the film-forming process in accordance with the embodiment.As shown in FIG. 11, in the fourth variant, a process of supplying TiCl₄gas, which is a metal-containing gas, and a process of supplying NH₃gas, which is a nitrogen-containing gas, are performed while a processof supplying O₂ gas, which is an oxygen-containing gas, is performed. Inaddition, in the fourth variant, the process of supplying TiCl₄ gas,which is a metal-containing gas, and the process of supplying NH₃ gas,which is a nitrogen-containing gas, are simultaneously performed. Here,supply periods of the TiCl₄ gas. NH₃ gas and O₂ gas supplied into theprocessing chamber 201 may overlap each other, and timings of supplyinitiation and supply stoppage may not be equal to each other.

For example, in FIG. 11, the process of supplying TiCl₄ gas, which is ametal-containing gas, the process of supplying NH₃ gas, which is anitrogen-containing gas, and the process of supplying O₂ gas, which isan oxygen-containing gas, are performed at substantially the same time.After the process of supplying TiCl₄ gas, which is a metal-containinggas, is terminated, the process of supplying NH₃ gas, which is anitrogen-containing gas, is terminated, and after the process ofsupplying NH₃ gas, which is a nitrogen-containing gas, is terminated,the process of supplying O₂ gas, which is an oxygen-containing gas, isterminated.

FIG. 12 is a timing chart showing a fifth variant of the film-formingsequence of the TiON film in the film-forming process. In the fifthvariant, a process of supplying TiCl₄ gas, which is a metal-containinggas, a process of supplying NH: gas, which is a nitrogen-containing gas,and a process of supplying O₂ gas, which is an oxygen-containing gas,are set as one cycle, and the cycle is repeated a plurality of times.

In the fifth variant, the process of supplying TiCl₄ gas, which is ametal-containing gas, and the process of supplying NH₃ gas, which is anitrogen-containing gas, are initiated at substantially the same time,and after the process of supplying TiCl₄ gas, which is ametal-containing gas, is terminated, the process of supplying NH₃ gas,which is a nitrogen-containing gas, is terminated.

FIG. 13 shows a first variant of the first gas supply system 300. Thefirst gas supply system 300 in accordance with the first embodiment asdescribed above includes the first gas supply pipe 310, the bubbler 700,the valve 318 disposed at the gas supply pipe 310 at an upstream side ofthe bubbler 700, the carrier gas supply pipe 360, the mass flowcontroller 362 mounted on the carrier gas supply pipe 360, and the valve364 mounted on the carrier gas supply pipe 360. On the other hand, thefirst gas supply system 300 in accordance with the first variantincludes a mass flow controller 370 and a valve 372, in addition to therespective elements included in the first gas supply system 300 of thefirst embodiment.

The mass flow controller 370 is mounted on the first gas supply pipe 310at a downstream side of the valve 318. In addition, the valve 372 ismounted on the first gas supply pipe 310 at a downstream side of themass flow controller 370. The mass flow controller 370 and the valve 372are controlled by the controller 900. Further, when a flow rate of thesupplied TiCl₄ gas is controlled, the mass flow controller 370 iscontrolled prior to the mass flow controller 362.

The first variant of the first gas supply system 300 has the sameconfiguration as the first gas supply system 300 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

FIG. 14 shows a second variant of the first gas supply system 300. Thefirst gas supply system 300 in accordance with the second variantincludes a valve 372, in addition to the respective members included inthe first gas supply system 300 in accordance with the first embodiment,and includes a mass flow controller 370 instead of the mass flowcontroller 362.

The mass flow controller 370 is mounted on the first gas supply pipe 310at a downstream side of the valve 318. In addition, the valve 372 ismounted on the first gas supply pipe 310 at a downstream side of themass flow controller 370. The mass flow controller 370 and the valve 372are controlled by the controller 900. Further, when a flow rate of thesupplied TiCl₄ gas is controlled, the mass flow controller 370 iscontrolled.

The second variant of the first gas supply system 300 has the sameconfiguration as the first gas supply system 300 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

FIG. 15 shows a third variant of the first gas supply system 300. Thefirst gas supply system 300 in accordance with the third variantincludes a mass flow controller 370, a valve 372, and a vent pipe 376,in addition to the respective members included in the first gas supplysystem 300 in accordance with the first embodiment.

The mass flow controller 370 is mounted on the first gas supply pipe 310at a downstream side of the valve 318. In addition, the valve 372 ismounted on the first gas supply pipe 310 at a downstream side of themass flow controller 370. The mass flow controller 370 and the valve 372are controlled by the controller 900. When a flow rate of the suppliedTiCl₄ gas is controlled, the mass flow controller 370 is controlledprior to the mass flow controller 362.

The vent pipe 376 is branched from the first gas supply pipe 310 at adownstream side of the valve 318 and an upstream side of the mass flowcontroller 370, and connected to the first gas supply pipe 310.

The third variant of the first gas supply system 300 has the sameconfiguration as the first gas supply system 300 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

FIG. 16 shows a third variant of the first gas supply system 300. Thefirst gas supply system 300 in accordance with the fourth variantincludes a mass flow controller 370, a valve 372, and a heating tank380, in addition to the respective members included in the first gassupply system 300 in accordance with the first embodiment.

The mass flow controller 370 is mounted on the first gas supply pipe 310at a downstream side of the valve 318. In addition, the valve 372 ismounted on the first gas supply pipe 310 at a downstream side of themass flow controller 370. The mass flow controller 370 and the valve 372are controlled by the controller 900. Further, when a flow rate of thesupplied TiCl₄ gas is controlled, the mass flow controller 370 iscontrolled prior to the mass flow controller 362.

The heating tank 380, which is a constant-temperature tank in which atemperature is constantly maintained, is used as a heating apparatus forheating the bubbler 700, and is configured to surround the bubbler 700,and heat the accommodating vessel 702 to heat the liquid TiCl₄accommodated in the accommodating vessel 702 to easily evaporate theliquid TiCl₄.

The fourth variant of the first gas supply system 300 has the sameconfiguration as the first gas supply system 300 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

FIG. 17 shows a fifth variant of the first gas supply system 300. Thefirst gas supply system 300 in accordance with the first embodimentincludes the accommodating vessel 702 configured to accommodate a liquidsource material, and the bubbler 700 used as an example of an evaporatorconfigured to evaporate the liquid source material through bubbling togenerate a source gas. On the other hand, the fifth variant includes anevaporator 720 configured to evaporate a liquid source material orvarious metal source materials dissolved in a solvent. The evaporator720 is used as an example of an evaporator configured to generate asource gas.

The accommodating vessel 726 is connected to the evaporator 720 via avalve 722 and a liquid mass flow controller 724. The accommodatingvessel 726 accommodates a liquid source material or various metal sourcematerials dissolved in a solvent, and the liquid source material orvarious metal source materials dissolved in the solvent are suppliedinto the evaporator 720 from the accommodating vessel 726 via the valve722 and the liquid mass flow controller.

A carrier gas supply pipe 730 is connected to the accommodating vessel726, and a mass flow controller 732 and a valve 734 are mounted on thecarrier gas supply pipe 730.

In the fifth variant, the evaporator 720, the valve 722, the liquid massflow controller 724, the mass flow controller 732 and the valve 734 arecontrolled by the controller 900.

The fifth variant of the first gas supply system 300 has the sameconfiguration as the first gas supply system 300 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

FIG. 18 shows a variant of the third gas supply system 500. In the firstgas supply system 300 in accordance with the first embodiment, an O₂(oxygen) gas supply source (not shown) is connected to an upstream sideend of the third gas supply pipe 510, and O₂ gas supplied from the O₂gas supply source is used as an oxygen-containing gas supplied into theprocessing chamber 201. In the variant, a bubbler 570 is mounted on anupstream side end of the third gas supply pipe 510, and vapor suppliedfrom the bubbler 570 is used as an oxygen-containing gas.

The bubbler 570 includes an accommodating vessel 572 configured toaccommodate H₂O (water), and evaporates water through bubbling togenerate vapor. The accommodating vessel 572 is a sealed vessel, and H₂Ois accommodated in the accommodating vessel 572. A carrier gas supplypipe 576 is connected to the accommodating vessel 572, and a mass flowcontroller 578 and a valve 580 are mounted on the carrier gas supplypipe 576.

In the variant, a mass flow controller 592 is mounted on the third gassupply pipe 510 at an upstream side of the valve 518, and a valve 594 ismounted on the third gas supply pipe 510 at an upstream side of the massflow controller 592. The mass flow controller 578, the valve 580, themass flow controller 592 and the valve 594 are controlled by thecontroller 900.

The variant of the third gas supply system 500 has the sameconfiguration as the third gas supply system 500 in the firstembodiment, except for the above description, and description of thesame configuration will not be repeated.

The respective variants as described above may be combined and used.That is, one of the first to third variants of the sequence of the firstfilm-forming process, the variant of the sequence of the secondfilm-forming process, one of the first to fifth variants of the firstgas supply system, and the variant of the third gas supply system may becombined to be used.

FIG. 19 schematically shows the first gas supply system and the secondgas supply system included in the substrate processing apparatus 101 inaccordance with the second embodiment of the present invention.

The substrate processing apparatus 101 in accordance with the firstembodiment includes the first gas supply system 300, the second gassupply system 400 and the third gas supply system 500. The first gassupply system 300 is used as an example of the first gas supply systemconfigured to supply a metal-containing gas into the processing chamber201, the second gas supply system 300 is used as an example of thesecond gas supply system configured to supply a nitrogen-containing gasinto the processing chamber 201, and the third gas supply system 500 isused as an example of the third gas supply system configured to supply anitrogen-containing gas or a halogen-containing gas into the processingchamber 201. On the other hand, in the second embodiment, the first gassupply system 300 is used as an example of the first gas supply systemconfigured to supply a metal-containing gas into the processing chamber201, and simultaneously, also used as the third gas supply systemconfigured to supply a nitrogen-containing gas or a halogen-containinggas into the processing chamber 201. In addition, in the secondembodiment, the second gas supply system 400 is used as an example ofthe second gas supply system configured to supply a nitrogen-containinggas into the processing chamber 201, and simultaneously, also used asthe third gas supply system configured to supply a nitrogen-containinggas or a halogen-containing gas into the processing chamber 201.

In the second embodiment, the first gas supply system 300 includes anoxygen supply pipe 390, a mass flow controller 392 and a valve 394, inaddition to the members included in the first gas supply system 300 ofthe first embodiment. A downstream side end of the oxygen supply pipe390 is connected to the first gas supply pipe 310 via the carrier gassupply pipe 330. In addition, an O₂ (oxygen) gas supply source (notshown) is connected to an upstream side end of the oxygen supply pipe390.

The mass flow controller 392 is used to adjust a flow rate of thesupplied O₂ (oxygen) gas, and mounted on the oxygen supply pipe 390. Thevalve 394 is used to stop and initiate supply of the O₂ (oxygen) gas,and mounted on the oxygen supply pipe 390 at a downstream side of themass flow controller 392.

In addition, in the second embodiment, the second gas supply system 400includes an oxygen supply pipe 490, a mass flow controller 492 and avalve 494, in addition to the members included in the second gas supplysystem 400 of the first embodiment. A downstream side end of the oxygensupply pipe 490 is connected to the fourth gas supply pipe 410 via thecarrier gas supply pipe 430. In addition, an O₂ (oxygen) gas supplysource (not shown) is connected to an upstream side end of the oxygensupply pipe 490.

The mass flow controller 492 is used to adjust a flow rate of thesupplied O₂ (oxygen) gas, and mounted on the oxygen supply pipe 490. Thevalve 494 is used to stop and initiate supply of the O₂ (oxygen) gas,and mounted on the oxygen supply pipe 490 at a downstream side of themass flow controller 492. The mass flow controller 392, the valve 394,the mass flow controller 492 and the valve 494 are controlled by thecontroller 900.

In addition, in the substrate processing apparatus 101 in accordancewith the second embodiment of the present invention, one of the first tofifth variants of the first gas supply system 300 in the firstembodiment may be used as the first gas supply system 300.

The substrate processing apparatus 101 in accordance with the secondembodiment is the same as the substrate processing apparatus 101 inaccordance with the first embodiment, except the configuration asdescribed above, and description of the same configuration will not berepeated.

FIG. 20 schematically shows a first variant of the first gas supplysystem 300 and the second gas supply system 400 included in thesubstrate processing apparatus 101 in accordance with the secondembodiment of the present invention. In the first variant, in additionto the configurations included in the first gas supply system and thesecond gas supply system in the second embodiment of the presentinvention, a large diameter part 331 having an inner diameter largerthan the other parts is formed in the carrier gas supply pipe 330. Thelarge diameter part 331 is formed at the carrier gas supply pipe 330 ata downstream side of a position to which the oxygen supply pipe 390 isconnected, and O₂ gas is uniformly diffused to a carrier gas as thecarrier gas and O₂ gas pass through the large diameter part 331.

In addition, in the first variant, in addition to the configurationsincluded in the first gas supply system and the second gas supply systemin the second embodiment of the present invention, a large diameter part431 having an inner diameter larger than the other parts is formed inthe carrier gas supply pipe 430. The large diameter part 431 is formedat the carrier gas supply pipe 430 at a downstream side of a position towhich the oxygen supply pipe 490 is connected, and O₂ gas is uniformlydiffused to a carrier gas as the carrier gas and O₂ gas pass through thelarge diameter part 431. The first variant of the first gas supplysystem 300 and the second gas supply system 400 is the same as thesecond embodiment, except for the configuration as described above, anddescription of the same configuration will not be repeated.

FIG. 21 schematically shows a second variant of the first gas supplysystem 300 and the second gas supply system 400 included in thesubstrate processing apparatus 101 in accordance with the secondembodiment of the present invention. In the first gas supply system 300and the second gas supply system 400 in accordance with the secondembodiment of the present invention. O₂ (oxygen) gas supply sources (notshown) are connected to upstream side ends of the oxygen supply pipe 390and the oxygen supply pipe 490, respectively, and O₂ gas supplied fromthe O₂ gas supply sources is used as an oxygen-containing gas suppliedinto the processing chamber 201. On the other hand, in the secondvariant, one bubbler 660 is mounted on the upstream side ends of theoxygen supply pipe 390 and the oxygen supply pipe 490, and vaporsupplied from the bubbler 600 is used as an oxygen-containing gas.

The bubbler 600 includes an accommodating vessel 602 configured toaccommodate H₂O (water), and evaporate the water through bubbling togenerate vapor. The accommodating vessel 602 is a sealed vessel, and H₂Ois accommodated in the accommodating vessel 602. A carrier gas supplypipe 620 is connected to the accommodating vessel 602, and a mass flowcontroller 622 and a valve 624 are mounted on the carrier gas supplypipe 620.

In addition, in the second variant, the oxygen supply pipe 390 and theoxygen supply pipe 490 are connected to each other at an upstream side,a mass flow controller 606 is mounted on the connected portion, and theconnected portion is connected to the bubbler 600. The mass flowcontroller 606, the valve 624 and the mass flow controller 622 arecontrolled by the controller 900. The second variant of the first gassupply system 300 and the second gas supply system 400 is the same asthe second embodiment, except for the configuration as described above,and description of the same configuration will not be repeated.

In the first embodiment, the second embodiment and the variants thereof,while the vapor is exemplarily used as O₂ gas, which is anoxygen-containing gas, instead of O₂ gas and vapor, or in combination ofO₂ gas and vapor, for example, NO, N₂O, O₃, etc. may be used as theoxygen-containing gas.

In addition, in the first embodiment, the second embodiment and thevariants thereof, while the oxygen-containing gas is supplied into theprocessing chamber 201, in addition to supply of the oxygen-containinggas into the processing chamber 201, a halogen-containing gas may besupplied into the processing chamber 201. For example, a gas containingfluorine or chlorine may be used as the halogen-containing gas suppliedinto the processing chamber 201.

As the halogen-containing gas instead of the oxygen-containing gas issupplied into the processing chamber 201, an increase in electricresistance of a conductive thin film can be suppressed,electro-negativity of the conductive thin film can be increased, and asa result, a work function of the conductive thin film can be increased.

In addition, as an addition method, a supply time and a concentration ofthe oxygen-containing gas or the halogen-containing gas are varied, aratio of oxygen included in the formed film can be controlled to adesired value.

Exemplary Embodiments of the Invention

Hereinafter, exemplary embodiments of the present invention will beadditionally stated.

[Supplementary Note 1]

A semiconductor device manufacturing method of forming ametal-containing film on a substrate, the method including:

(a) supplying a metal-containing gas into a processing chamber where thesubstrate is accommodated:

(b) supplying a nitrogen-containing gas into the processing chamber; and

(c) supplying the metal-containing gas and the nitrogen-containing gasinto the processing chamber, and supplying one of an oxygen-containinggas, a halogen-containing gas and a combination thereof into theprocessing chamber.

[Supplementary Note 2]

The semiconductor device manufacturing method according to SupplementaryNote 1, wherein steps (a), (b) and (c) are set as one cycle, and thecycle is repeated a plurality of times.

[Supplementary Note 3]

The semiconductor device manufacturing method according to SupplementaryNote 2, further including (d) removing the gas remaining in theprocessing chamber from the processing chamber,

wherein step (d) is performed at least one of between step (a) and step(b), between step (b) and step (c), and after step (c), and before step(a).

[Supplementary Note 4]

The semiconductor device manufacturing method according to SupplementaryNote 1, wherein step (a) and step (b) are set as one cycle, the cycle isperformed a plurality of times, and then step (c) is performed.

[Supplementary Note 5]

The semiconductor device manufacturing method according to SupplementaryNote 4, further including (d) removing the gas remaining in theprocessing chamber from the processing chamber,

wherein step (d) is performed at least one of between step (a) and step(b), between step (b) and step (c), and after step (c), and before step(a).

[Supplementary Note 6]

A semiconductor device manufacturing method of forming ametal-containing film on a substrate, the method including:

(a) supplying a metal-containing gas into a processing chamber where thesubstrate is accommodated;

(b) supplying a nitrogen-containing gas into the processing chamber; and

(c) supplying one of an oxygen-containing gas, a halogen-containing gasand a combination thereof into the processing chamber,

wherein at least one of step (a) and step (b) is performed while step(c) is performed.

[Supplementary Note 7]

The semiconductor device manufacturing method according to SupplementaryNote 6, wherein while step (c) is performed, step (a) and step (b) arealternately performed a plurality of times.

[Supplementary Note 8]

The semiconductor device manufacturing method according to SupplementaryNote 6, wherein step (a) and step (b) are simultaneously performed.

[Supplementary Note 9]

The semiconductor device manufacturing method according to one ofSupplementary Notes 1 to 8, wherein an oxygen content or a halogencontent of the metal-containing film formed on the substrate iscontrolled in at least one of the steps (a), (b) and (c) to be at apredetermined level.

[Supplementary Note 10]

The semiconductor device manufacturing method according to SupplementaryNote 9, wherein, in step (c), a supply amount of the oxygen-containinggas or the halogen-containing gas is controlled such that the oxygencontent or the halogen content of the metal-containing film formed onthe substrate is at the predetermined level.

[Supplementary Note 11]

A substrate processing apparatus including:

a processing chamber configured to accommodate a substrate;

a first gas supply system configured to supply a metal-containing gasinto the processing chamber;

a second gas supply system configured to supply a nitrogen-containinggas into the processing chamber;

a third gas supply system configured to supply one of anoxygen-containing gas, a halogen-containing gas and a combinationthereof into the processing chamber; and

a control unit configured to control the first gas supply system, thesecond gas supply system and the third gas supply system,

wherein the control unit controls the first gas supply system, thesecond gas supply system and the third gas supply system such that anoxygen content or a halogen content of a metal-containing film formed onthe substrate is at a predetermined level.

[Supplementary Note 12]

The substrate processing apparatus according to Supplementary Note 11,wherein the control unit controls the first gas supply system, thesecond gas supply system and the third gas supply system such thatsupply of the metal-containing gas into the processing chamber, supplyof the nitrogen-containing gas into the processing chamber, and supplyof one of the oxygen-containing gas, the halogen-containing gas and acombination thereof are set as one cycle and the cycle is repeated aplurality of times, and controls a supply amount of theoxygen-containing gas or the halogen-containing gas into the processingchamber by the third gas supply system such that the oxygen content orthe halogen content of the metal-containing film formed on the substrateis at the predetermined level.

[Supplementary Note 13]

The substrate processing apparatus according to Supplementary Note 12,wherein the third gas supply system further includes:

a flow rate control mechanism configured to control a flow rate of theoxygen-containing gas or the halogen-containing gas; and

an opening/closing valve installed between the flow rate controlmechanism and the processing chamber.

[Supplementary Note 14]

A method of forming a thin film, including:

a metal material supply process of supplying a metal material into aprocessing chamber, in which a substrate is accommodated, to form thethin film on the substrate;

a first supply process of supplying a first source material into theprocessing chamber to process at least one of reduction and nitridationof the metal material; and

a second supply process of supplying a second source material into theprocessing chamber to process at least one of oxidation and halogenationof the metal material,

wherein, in the second supply process, a flow rate of the second sourcematerial is controlled such that an introduction amount of oxygen or ahalogen introduced into the thin film formed on the substrate becomes apredetermined value.

[Supplementary Note 15]

The method of forming a thin film according to Supplementary Note 14,wherein the second supply process includes:

a process of enabling supply of the second source material into theprocessing chamber using a valve; and

a process of stopping supply of the second source material into theprocessing chamber using the valve.

[Supplementary Note 16]

The method of forming a thin film according to Supplementary Note 14 or15, wherein, in the second supply process, a flow rate of the secondsource material is independently controlled from a flow rate of anothermaterial supplied into the second supply system.

[Supplementary Note 17]

The method of forming a thin film according to one of SupplementaryNotes 14 to 16, wherein, in the first supply process, the first sourcematerial is mixed with an inert gas and supplied, and in the secondsupply process, the second source material is mixed with the inert gasand supplied.

[Supplementary Note 18]

The method of forming a thin film according to Supplementary Note 17,further including:

a process of uniformly mixing the first source material and the inertgas; and

a process of uniformly mixing the second source material and the inertgas.

[Supplementary Note 19]

The method of forming a thin film according to one of SupplementaryNotes 14 to 18, wherein the second supply process further includes atleast one of a bubble generating process of generating bubbles in wateraccommodated in a water accommodating part; and an evaporating processof evaporating the water accommodated in the water accommodating part.

[Supplementary Note 20]

The method of forming a thin film according to one of SupplementaryNotes 14 to 19, wherein the metal material supply process includes atleast one of a process of mixing the metal material formed of a liquidmaterial accommodated in a metal material accommodating part with acarrier gas; a process of heating the metal material formed of a liquidmaterial accommodated in the metal material accommodating part; and aprocess of evaporating the metal material formed of a liquid materialaccommodated in the metal material accommodating part.

[Supplementary Note 21]

A thin film forming apparatus including:

a processing chamber configured to accommodate a substrate;

a metal material supply system configured to supply a metal materialinto the processing chamber to form a thin film on the substrate;

a first supply system configured to supply a first source material intothe processing chamber to process at least one of reduction andnitridation of the metal material; and

a second supply system configured to supply a second source material toprocess at least one of oxidation and halogenation of the metalmaterial,

wherein the second supply system includes a flow rate control mechanismconfigured to control a flow rate of the second source material, and

the flow rate control mechanism controls a flow rate of the secondsource material such that an introduction amount of oxygen or a halogenintroduced into the thin film formed on the substrate becomes apredetermined value.

[Supplementary Note 22]

The thin film forming apparatus according to Supplementary Note 21,wherein the second supply system further includes a valve configured toenable supply of the second source material into the processing chamberand stop supply of the second source material into the processingchamber.

[Supplementary Note 23]

The thin film forming apparatus according to Supplementary Note 21 or22, wherein the flow rate control mechanism independently controls aflow rate of the second source material from a flow rate of anothermaterial supplied into the second supply system.

[Supplementary Note 24]

A thin film forming apparatus including:

a processing chamber configured to accommodate a substrate;

a metal material supply system configured to supply a metal materialinto the processing chamber to form a thin film on the substrate; and

a first supply system configured to supply a first source material intothe processing chamber to process at least one of reduction andnitridation of the metal material.

wherein the metal material supply system includes a first inert gassupply pipe configured to supply an inert gas into the metal gas supplysystem,

the first supply system includes a second inert gas supply pipeconfigured to supply the inert gas into the first supply system,

further including a second supply system configured to supply a secondsource material to process at least one of oxidation and halogenation ofthe metal material into one of the first inert gas supply pipe and thesecond inert gas supply pipe,

wherein the second supply system includes a flow rate control mechanismconfigured to control a flow rate of the second source material, and

the flow rate control mechanism controls a flow rate of the secondsource material such that an introduction amount of oxygen or a halogenintroduced into the thin film formed on the substrate becomes apredetermined value.

[Supplementary Note 25]

The thin film forming apparatus according to Supplementary Note 24,wherein the first inert gas supply pipe includes a first large diameterpart having a larger inner diameter than that of other parts, and

the second inert gas supply pipe includes a second large diameter parthaving a larger inner diameter than that of the other parts.

[Supplementary Note 26]

The thin film forming apparatus according to one of Supplementary Notes21 to 25, wherein the second supply system further includes:

a water accommodating part configured to accommodate water; and

at least one of a bubble generating apparatus configured to generatebubbles from the water accommodated in the water accommodating part andan evaporating apparatus configured to evaporate the water accommodatedin the water accommodating part.

[Supplementary Note 27]

The thin film forming apparatus according to one of Supplementary Notes21 to 26, wherein the metal material supply system includes:

a metal material accommodating part configured to accommodate the metalmaterial formed of a liquid material; and

at least one of a mixing apparatus configured to mix the metal materialaccommodated in the metal material accommodating part with a carriergas, a heating apparatus configured to heat the metal materialaccommodated in the metal material accommodating part, and anevaporating apparatus configured to evaporate the metal materialaccommodated in the metal material accommodating part.

[Supplementary Note 28]

A semiconductor device manufacturing method of forming ametal-containing film on a substrate, the method including repeating acycle a plurality of times, wherein the cycle includes:

(a) supplying a metal-containing gas into a processing chamber where thesubstrate is accommodated;

(b) supplying a nitrogen-containing gas into the processing chamber; and

(c) supplying one of an oxygen-containing gas, a halogen-containing gasand a combination thereof into the processing chamber.

[Supplementary Note 29]

A semiconductor device manufacturing method, including:

(a) forming a metal nitride film on a substrate by performing a cycleincluding supplying a metal-containing gas into a processing chamber inwhich the substrate is accommodated and supplying a nitrogen-containinggas into the processing chamber a plurality of times; and

(b) after step (a), performing a process of supplying one of anoxygen-containing gas, a halogen-containing gas and a combinationthereof into the processing chamber to add oxygen into the metal nitridefilm.

[Supplementary Note 30]

A semiconductor device manufacturing method of forming ametal-containing film on a substrate, the method comprising repeating acycle a plurality of times,

wherein the cycle includes:

(a) supplying a metal-containing gas into a processing chamber in whichthe substrate is accommodated;

(b) supplying a nitrogen-containing gas into the processing chamber; and

(c) supplying one of an oxygen-containing gas, a halogen-containing gasand a combination thereof into the processing chamber,

wherein at least one of step (a) and step (b) is performed while step(c) is performed.

[Supplementary Note 31]

A substrate processing apparatus including:

a processing chamber configured to accommodate a substrate;

a first gas supply system configured to supply a metal-containing gasinto the processing chamber;

a second gas supply system configured to supply a nitrogen-containinggas into the processing chamber;

a third gas supply system configured to supply one of anoxygen-containing gas, a halogen-containing gas and a combinationthereof into the processing chamber; and

a control unit configured to control the first gas supply system, thesecond gas supply system and the third gas supply system,

wherein the control unit controls the first gas supply system, thesecond gas supply system and the third gas supply system such that anoxygen content or a halogen content of a metal-containing film formed onthe substrate is at a predetermined level.

[Supplementary Note 32]

A substrate processing method of forming a metal-containing film on asubstrate, the method including repeating a cycle a plurality of times.

wherein the cycle includes:

(a) supplying a metal-containing gas into a processing chamber where thesubstrate is accommodated;

(b) supplying a nitrogen-containing gas into the processing chamber; and

(c) supplying one of an oxygen-containing gas, a halogen-containing gasand a combination thereof into the processing chamber.

[Supplementary Note 33]

A program causing a computer to function as a control unit configured tocontrol a first gas supply system to supply a metal-containing gas of apredetermined amount into a processing chamber in which a substrate isaccommodated,

control a second gas supply system to supply a nitrogen-containing gasof a predetermined amount into the processing chamber,

control a third gas supply system to supply one of an oxygen-containinggas, a halogen-containing gas and a combination thereof of apredetermined amount into the processing chamber; and

control an exhaust system configured to exhaust the processing chambersuch that the processing chamber is exhausted in a predetermined exhaustamount.

[Supplementary Note 34]

A computer-readable recording medium in which the program according toSupplementary Note 33 is recorded.

What is claimed is:
 1. A semiconductor device manufacturing method offorming a metal-containing film on a substrate, the method comprising:(a) supplying a metal-containing gas simultaneously with one selectedfrom the group consisting of an oxygen-containing gas, ahalogen-containing gas and combinations thereof into a processingchamber accommodating the substrate; and (b) supplying anitrogen-containing gas with one of the oxygen-containing gas, thehalogen-containing gas and the combinations thereof into the processingchamber.
 2. The method according to claim 1, wherein the steps (a) and(b) are performed without mixing the metal-containing gas and thenitrogen-containing gas.
 3. The method according to claim 1, wherein thesteps (a) and (b) are simultaneously performed.
 4. A semiconductordevice manufacturing method of forming a metal-containing film on asubstrate, the method comprising: (a) simultaneously supplying ametal-containing gas and a nitrogen-containing gas into a processingchamber accommodating the substrate; and (b) supplying one selected fromthe group consisting of an oxygen-containing gas, a halogen-containinggas and combinations thereof into the processing chamber, wherein a timeduration of supplying the metal-containing gas is shorter than that ofthe nitrogen-containing gas in the step (a), and the steps (a) and (b)are alternately performed as a temporally separated pulse.
 5. The methodaccording to claim 4, a concentration of oxygen in the metal-containingfilm is controlled by adjusting at least one of a time duration ofsupplying the oxygen-containing gas and a concentration of theoxygen-containing gas.
 6. The method according to claim 5, a workfunction of the metal-containing film is adjusted by controlling theconcentration of oxygen in the metal-containing film.
 7. A substrateprocessing apparatus comprising: a processing chamber configured toaccommodate a substrate; a gas supply system configured to supply ametal-containing gas, a nitrogen-containing gas, and one selected fromthe group consisting of an oxygen-containing gas, a halogen-containinggas and combinations thereof into the processing chamber; and acontroller configured to control the gas supply system to perform: (a)supplying the metal-containing gas simultaneously with the one selectedfrom the group consisting of the oxygen-containing gas, thehalogen-containing gas and the combinations thereof into the processingchamber; and (b) supplying the nitrogen-containing gas with the oneselected from the group consisting of the oxygen-containing gas, thehalogen-containing gas and the combinations thereof into the processingchamber.